Semiconductor device in a recess of a semiconductor plate

Details Semiconductor device in a recess of a semiconductor plate Semiconductor device in a recess of a semiconductor plate

2007-02-27

2007-02-27

Ha, Nathan W. (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C257S678000

Reexamination Certificate

active

10356613

ABSTRACT:
A semiconductor device provided with one or more semiconductor pellets arranged on the bottom surface of a recess produced along a surface of a semiconductor plate having wirings arranged on the surface thereof, wirings extending toward the surface of the recess, and the recess being buried with a layer of a resin which is inclined to inflate, while it is hardened, resultantly producing a stress in the resin layer to expand toward the side wall of the recess engraved in the semiconductor plate, resultantly preventing breakage from happening for an interface between the side wall of the recess engraved in the semiconductor plate and the surface of the resin layer contacting the side wall, and remarkably improving the thermal conductivity efficiency to reduce the magnitude of a temperature rise of the semiconductor device, resultantly preventing a delay from happening for the operation speed of the semiconductor device.

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