Inductor devices – Coil or coil turn supports or spacers – Printed circuit-type coil
Reexamination Certificate
2007-12-18
2007-12-18
Nguyen, Tuyen T. (Department: 2832)
Inductor devices
Coil or coil turn supports or spacers
Printed circuit-type coil
Reexamination Certificate
active
09997378
ABSTRACT:
It has been discovered that an inductor may be made to include a surface rotational portion instead of a coil to provide a low inductance inductor with sufficient quality factor. The surface rotational portion is a conducting structure which is substantially enclosed along the length of the structure and which has openings at each end of the structure and an opening along the length of the structure between the end openings. One example of such a structure is a cylinder having a lateral opening and openings at its ends or bases. Another example of such a structure is a duct-shape or rectangular structure. Any appropriately shaped surface may be used to rotate current, and varying thicknesses and lengths may be used as appropriate.
REFERENCES:
patent: 3988665 (1976-10-01), Neumaier et al.
patent: 5083236 (1992-01-01), Chason et al.
patent: 5446311 (1995-08-01), Ewen et al.
patent: 5459368 (1995-10-01), Onishi et al.
patent: 5461353 (1995-10-01), Eberhardt
patent: 5559360 (1996-09-01), Chiu et al.
patent: 5760456 (1998-06-01), Grzegorek et al.
patent: 5793272 (1998-08-01), Burghartz et al.
patent: 5884990 (1999-03-01), Burghartz et al.
patent: 5918121 (1999-06-01), Wen et al.
patent: 5959515 (1999-09-01), Cornett et al.
patent: 5959522 (1999-09-01), Andrews
patent: 6008102 (1999-12-01), Alford et al.
patent: 6037649 (2000-03-01), Liou
patent: 6046109 (2000-04-01), Liao et al.
patent: 6054329 (2000-04-01), Burghartz et al.
patent: 6114937 (2000-09-01), Burghartz et al.
patent: 6124624 (2000-09-01), Van Roosmalen et al.
patent: 6146958 (2000-11-01), Zhao et al.
patent: 6153489 (2000-11-01), Park et al.
patent: 6169008 (2001-01-01), Wen et al.
patent: 6218729 (2001-04-01), Zavrel, Jr. et al.
patent: 6362525 (2002-03-01), Rahim
patent: 6373369 (2002-04-01), Huang et al.
patent: 6389691 (2002-05-01), Rinne et al.
patent: 6486534 (2002-11-01), Sridharan et al.
patent: 6501169 (2002-12-01), Aoki et al.
patent: 6534843 (2003-03-01), Acosta et al.
patent: 6600208 (2003-07-01), Brennan et al.
patent: 6847282 (2005-01-01), Gomez et al.
patent: 6873065 (2005-03-01), Haigh et al.
patent: 2001/0013821 (2001-08-01), Huang et al.
patent: 2002/0109204 (2002-08-01), Acosta et al.
patent: 2002/0140081 (2002-10-01), Chou et al.
patent: 0 675 539 (1995-10-01), None
patent: 62-241311 (1987-10-01), None
patent: 06-053042 (1994-02-01), None
Frommberger, Michael, et al., “Integration of Crossed Anisotropy Magnetic Core Into Toroidal Thin-Film Inductors”, IEEE Transactions on Microwave Theory and Techniques, vol. 53, No. 6, Jun. 2005, pp. 2096-2100l, no date.
Kim, Sung-Jin, et al., “Realization of High-Q Inductors Using Wirebonding Technology ”, School of Electronics engineering, Ajou University, AP-ASIG Proceedings, Aug. 1994, 4 pages, no date.
Long, John R. and Miles A. Copeland, “The Modeling, Characterization, and Design of Monolithic Inductors for Silicon RF IC 's, ”IEEE Journal of Solid-State Circuits, vol. 32, No. 3, Mar. 1997, pp. 357-369, no date.
Soh, H. T., et al., “Through-Wafer Vias (TWV) and their Applications in 3 Dimensional Structures” , Proceedings of 1998 International Conference on Solid State Devices and Materials, Sep. 1998, 12 pages, no date.
Tang, Chih-Chun, et al. “Miniature 3-D Inductors in Standard CMOS Process ”, IEEE Journal of Solid-State Circuits, vol. 37, No. 4, Apr. 2002, pp. 471-480 no date.
Tsui, Hau-Yiu and Jack Lau, 2003 IEEE MTT-S Digest, pp. 225-228, no month.
Wu, Joyce H., et al., “A tThrough-Wafer Interconnect in Silicon for RFICs” IEEE Transactions on Electron Devices, vol. 51, No. 11, Nov. 2004, pp. 1765-1771, no date.
Zannoth, Markus, et al., “A Fully Integrated VCO at 2 GHz ”, IEEE Journal of Solid-State Circuits, vol. 33, No. 12, Dec. 1998, pp. 1987-1991, no date.
Zou, Jun, et al., Development of Vertical Planar Coil Inductors Using Plastic Deformation Magnetic Assembly (PDMA), 2001 IEEE International Microwave Symposium, May 2001, 4 pages, no date.
Nguyen Tuyen T.
Silicon Laboratories Inc.
Zagorin O'Brien Graham LLP
LandOfFree
Surface inductor does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Surface inductor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Surface inductor will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3873383