Method and apparatus for laser cutting and drilling of...

Details Method and apparatus for laser cutting and drilling of... Method and apparatus for laser cutting and drilling of...

2007-02-06

2007-02-06

Evans, Geoffrey S. (Department: 1725)

Electric heating

Metal heating

By arc

C219S121610, C219S121710

Reexamination Certificate

active

11057109

ABSTRACT:
A method for laser drilling and laser cutting of semiconductor material or glass in pulsed regime permits, for a given laser power, a rate of material cutting which is substantially higher than the rate obtained using conventional laser cutting. The hole or cut produced by the laser-induced removal of material has a reproducible shape, the drilling or cutting does not produce material debris or spatter deposition around the crater or cut, and the cracking of the crater or cut walls is prevented. The method includes utilization of a unique physical model representing all main physical processes taking place during laser-assisted material deposition, a corresponding mathematical model consisting of equations describing the relevant physical processes, and a computer code used for numerical calculations of the parameters of interest according to the mathematical model.

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