Dicing die-bonding film

Details Dicing die-bonding film Dicing die-bonding film

2007-08-21

2007-08-21

Sikder, Selina (Department: 2912)

Equipment for production, distribution, or transformation of ene

Distribution, modification or control

Semiconductor, transistor or integrated circuit

Design Patent

active

29225423

CLAIM:
The ornamental design for a dicing die-bonding film, as shown and described.

REFERENCES:
patent: 4961804 (1990-10-01), Aurichio
patent: 5844348 (1998-12-01), Gamo
patent: 6457220 (2002-10-01), Hamano
patent: 6977024 (2005-12-01), Yamazaki et al.
patent: 7054161 (2006-05-01), James
patent: 2003/0207479 (2003-11-01), Border et al.
patent: 2003/0226640 (2003-12-01), Yamazaki et al.
patent: 2005/0139973 (2005-06-01), Matsumura et al.
patent: 2005/0208736 (2005-09-01), Matsumura et al.

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