Method and apparatus for manufacturing electronic...

Details Method and apparatus for manufacturing electronic... Method and apparatus for manufacturing electronic...

2007-02-13

2007-02-13

Schillinger, Laura M. (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S121000, C438S107000

Reexamination Certificate

active

10285475

ABSTRACT:
After a first electronic component is inserted into a base substrate, first circuit patterns are formed on the inserted first electronic component, and then a second electronic component is mounted on the first circuit patterns to complete an electronic component-mounted component. According to the above method, a thickness of a module may be decreased by a thickness of the base substrate. Further, since electronic components are surface-mounted, electronic components of arbitrary sizes and types may be used.

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