Substrate cutting device and method

Details Substrate cutting device and method Substrate cutting device and method

2007-02-27

2007-02-27

Ashley, Boyer D. (Department: 3724)

Severing by tearing or breaking

Methods

With preliminary weakening

C029S762000, C083S177000, C083S870000, C156S345420, C156S583200, C225S105000, C438S455000, C438S458000

Reexamination Certificate

active

10883435

ABSTRACT:
An automatic cutting device is described for cutting an assembly. The assembly includes a material having a weakened zone therein that defines a useful layer and being attached to a source substrate. The cutting device includes a cutting mechanism and a holding and positioning mechanism operatively associated with the cutting mechanism. The holding and positioning mechanism positions the material so that the cutting mechanism detaches the layer from the source substrate along the weakened zone. The cutting device also includes a control mechanism for adjusting at least two different portions of the assembly during detachment of the layer to facilitate a more precise detachment.

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