Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-02-27
2007-02-27
Dinh, Tuan (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S790000, C257S686000
Reexamination Certificate
active
10895386
ABSTRACT:
A semiconductor device includes a plurality of semiconductor chips; and a plurality of substrates, each of the substrates having one of the semiconductor chips mounted thereon. The substrates are stacked each other. The upper and lower ones of the semiconductor chips mounted on a pair of the stacked substrates are electrically connected through first terminals provided in a region outside the region in which one of the semiconductor chips is mounted in each of the substrates. The lowest one of the substrates has second terminals provided in its region closer to its center than its region in which the first terminals are provided, the second terminals electrically connected to one of the semiconductor chips. A pitch of adjacent two of the second terminals is wider than a pitch of adjacent two of the first terminals.
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