Connection structure for printed wiring board

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...

Reexamination Certificate

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C439S055000, C439S492000

Reexamination Certificate

active

10554744

ABSTRACT:
A connection structure for a printed wiring board which enables high density integration is provided. A FCP2includes an exposed conductor part2A including an insulating substrate22and a reinforcing plate24stacked with this substrate22via an elastic member23. In the exposed conductor part2A, conductors21each having a protrusion20formed on a surface is placed on the insulating substrate. The exposed conductor part2A can be elastically deformed in the thickness direction in which the substrate22, the reinforcing plate24and the like are stacked. A printed wiring board1is constructed by stacking an inner layer board10and a first outer layer board11and a second outer layer board12which sandwich this inner layer board10. A notched groove10A is formed on the inner layer board10, and an insertion opening10B is formed. Through-hole ports11which appear on the notched groove10A side is placed on the first outer layer board. When the FPC2is inserted into the insertion opening10B, the protrusion20of the FPC2fits with the through-hole port11A from within insertion opening10B and presses thereto.

REFERENCES:
patent: 4116516 (1978-09-01), Griffin
patent: 4116517 (1978-09-01), Selvin et al.
patent: 4587596 (1986-05-01), Bunnell
patent: 5222668 (1993-06-01), Frankeny et al.
patent: 5482473 (1996-01-01), Lord et al.
patent: 2002/0076953 (2002-06-01), Terai
patent: 2006/0234521 (2006-10-01), Uchida et al.
patent: EP 0106990 (1983-02-01), None
patent: HO5-028066 (1993-04-01), None
patent: HO7-018358 (1995-03-01), None
patent: HO7-022571 (1995-04-01), None
patent: HO7-170076 (1995-07-01), None
patent: HO9-102368 (1997-04-01), None
patent: 2002-015800 (2002-01-01), None
patent: 2002-083648 (2002-03-01), None
patent: 2002-158055 (2002-05-01), None
Internaional Search Report mailed on Jun. 15, 2004.

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