Multilayer coil assembly and method of production

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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C029S592100, C029S602100, C029S609000, C216S022000, C216S039000, C216S041000, C216S048000, C336S065000, C336S083000, C336S200000, C336S206000, C336S223000, C336S232000, C336S233000

Reexamination Certificate

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11308405

ABSTRACT:
Embodiments of the present invention provide a thin-film coil assembly. The coil assembly includes a substrate, at least two layers of conductive material on top of the substrate, and one layer of insulating material between the two layers of conductive material, wherein the two layers of conductive material are in contact with two interconnects, respectively, which extends substantially vertical to the substrate.

REFERENCES:
patent: 5095357 (1992-03-01), Andoh et al.
patent: 5319158 (1994-06-01), Lee et al.
patent: 6037649 (2000-03-01), Liou
patent: 6444920 (2002-09-01), Klee et al.
patent: 2003/0157368 (2003-08-01), Nguyen Van Dau et al.
patent: 2004/0130323 (2004-07-01), Oohashi et al.
patent: 05121239 (1993-05-01), None
“Electromechanical analysis of a prototype 20 Tesla, single turn toroidal field coil for IGNITEX”; Hsieh, K.T.; Driga, M.D.; Weldon, W.F.; Werst, M.D.; Fusion Engineering, 1989. Proceedings., IEEE Thirteenth Symposium on Oct. 2-6, 1989; pp. 1138-1141.

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