Method of manufacturing circuit board

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S825000, C029S830000, C029S846000

Reexamination Certificate

active

10535158

ABSTRACT:
A pre-preg sheet includes a substrate and a resin impregnated in the substrate. A first metal foil is placed on the pre-preg sheet to provide a laminated body. The laminated body is put in a heating device having a temperature maintained at a temperature close to a softening temperature of the resin. The laminated body is compressed at the temperature at a predetermined pressure. The first metal foil is bonded to the pre-preg sheet of the laminated body and hardening the resin, thus providing a circuit board. This method provides a stable resistance of a conductive paste filing a through-hole in the pre-preg sheet to be compressed at a small rate.

REFERENCES:
patent: 3990926 (1976-11-01), Konicek
patent: 4715116 (1987-12-01), Thorpe et al.
patent: 5527998 (1996-06-01), Anderson et al.
patent: 5617629 (1997-04-01), Ekstrom
patent: 5800650 (1998-09-01), Anderson et al.
patent: 6163957 (2000-12-01), Jiang et al.
patent: 6183880 (2001-02-01), Yoshioka et al.
patent: 7181839 (2007-02-01), Takenaka et al.
patent: 2001/0029666 (2001-10-01), Nakamura et al.
patent: 11-026902 (1999-01-01), None
patent: 11-238958 (1999-08-01), None
patent: 2002-067061 (2002-03-01), None
patent: 2003/158366 (2003-05-01), None
patent: 2003-179356 (2003-06-01), None
patent: 2003-213017 (2003-07-01), None
patent: 2004-221236 (2004-08-01), None
patent: 2004-221237 (2004-08-01), None

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