Method of manufacturing an on-chip transformer balun

Details Method of manufacturing an on-chip transformer balun Method of manufacturing an on-chip transformer balun

2007-02-06

2007-02-06

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C336S200000, C336S232000

Reexamination Certificate

active

10727378

ABSTRACT:
A method of manufacturing an on-chip transformer balun includes creating, on a semiconductor substrate, a primary winding having at least one substantially symmetrical primary turn on a first dielectric layer and at least one metal bridge on a second layer. A secondary winding is created on the semiconductor substrate, the secondary winding having at least one substantially symmetrical secondary turn on a third dielectric layer and at least one metal bridge on a fourth dielectric layer. In an alternative embodiment, the primary winding has at least one first primary turn on a first dielectric layer and at least one second primary turn on a second dielectric layer and at least one via that operably connects the first primary turn to the second primary turn. The secondary winding has at least one first secondary turn on a third dielectric layer and at least one second secondary turn on a fourth dielectric layer.

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