Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate
2007-12-04
2007-12-04
Pham, Long (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Wire contact, lead, or bond
C257S678000, C438S106000
Reexamination Certificate
active
10807789
ABSTRACT:
A technique is provided for communicatively coupling internal circuitry (e.g., a resonant tank) of an integrated circuit (“IC”) with pins of the IC's package in a manner that minimizes the inductance of such coupling. In certain embodiments, more than two bondwires are coupled to an electrically common interface, wherein the bondwires are used for carrying a signal of the internal circuitry of the IC. More particularly, in certain implementations the bondwires are used as inductors for the internal circuitry (e.g., a resonant tank) of the IC. In certain embodiments, a plurality of bondwires are coupled to a plurality of IC package pins, which are electrically coupled together. By carrying signals of opposite polarity on each of the bondwires, the inductance of such bondwires is minimized.
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“VCO Tank Design for the MAX2310”, Dallas Semiconductor Maxim [online], 19 pages Retrieved on Feb. 22, 2004 Retrieved from: http://www.maxim-ic.com/appnotes.cfm/appnote—number/336/In/en.
Fulbright & Jaworski LLP
Microtune ( Texas), L.P.
Pham Long
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