Method of fabricating rigid flexible printed circuit board

Details Method of fabricating rigid flexible printed circuit board Method of fabricating rigid flexible printed circuit board

2007-11-13

2007-11-13

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S829000, C029S846000, C029S847000, C029S852000, C156S150000, C156S292000

Reexamination Certificate

active

11093996

ABSTRACT:
Disclosed is a method of fabricating rigid flexible PCBs. In the method, a self-detachable adhesive tape is used to separate a wafer and a substrate from each other in the course of conventionally fabricating a semiconductor wafer, is employed to avoid inherent problems occurring in the conventional method of fabricating rigid flexible PCBs.

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patent: 7082679 (2006-08-01), Myoung et al.
patent: 7180315 (2007-02-01), Tunaboylu
patent: 5-243737 (1993-09-01), None
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patent: 2001-15917 (2001-01-01), None
patent: 2001-200234 (2001-07-01), None
Patent Abstracts of Japan for JP2003231875 A published Aug. 19, 2003.
Patent Abstracts of Japan for JP2000332416 A published on Nov. 30, 2000.

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