Method of electron beam exposure

Details Method of electron beam exposure Method of electron beam exposure

1980-06-25

1982-03-30

Dixon, Harold A.

Radiant energy

Irradiation of objects or material

Irradiation of semiconductor devices

250400, A61K 2702, G01K 108

Patent

active

043226264

ABSTRACT:
A method of electron beam exposure for directly writing patterns on chips of a semiconductor wafer with an electron beam, in which each of the chips is sectioned into a plurality of exposure fields, and at least one alignment mark is formed in only one exposure field of eachg chip. The alignment of the entire wafer with the electron beam is preliminarily adjusted, the alignment of a particular chip with the electron beam is adjusted relying on the alignment mark on the chips, and the exposure fields of the desired chip are successively exposed to the electron beam so that the entire chip is exposed. The remaining chips are successively adjusted in alignment and exposed in the same manner as defined above, whereby the entire wafer is exposed.

REFERENCES:
patent: 4008402 (1977-02-01), O'Keeffe et al.

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