Heat treating assembly and method

Details Heat treating assembly and method Heat treating assembly and method

2007-08-21

2007-08-21

Heinrich, Samuel M. (Department: 1725)

Electric heating

Metal heating

By arc

C219S121680

Reexamination Certificate

active

10935546

ABSTRACT:
The subject invention provides a heat treating assembly. The heat treating assembly comprises a laser, a substrate, and a tool. The laser emits laser energy directed toward the substrate and the tool. The substrate absorbs the laser energy and produces heat energy within the substrate that alters the substrate. The tool is disposed in removable contact with the substrate to conduct the heat energy away from the substrate to limit the altering of the substrate. Preferably, the tool has a thermal conductivity greater than that of the substrate and is more preferably a copper material, a gold material, a silver material, or an aluminum material.

REFERENCES:
patent: 3358751 (1967-12-01), Berwald et al.
patent: 3480486 (1969-11-01), Tanaka et al.
patent: 3552630 (1971-01-01), Dean
patent: 3874443 (1975-04-01), Bayer, Jr.
patent: 4151014 (1979-04-01), Charschan et al.
patent: 4288679 (1981-09-01), La Rocca
patent: 4313771 (1982-02-01), Lorenzo et al.
patent: 4319707 (1982-03-01), Knemeyer
patent: 4401726 (1983-08-01), Gnanamuthu
patent: 4405386 (1983-09-01), Mravic et al.
patent: 4457360 (1984-07-01), Roose
patent: 4502273 (1985-03-01), Miyamoto et al.
patent: 4838477 (1989-06-01), Roach et al.
patent: 4895735 (1990-01-01), Cook
patent: 5024371 (1991-06-01), Unde
patent: 5043244 (1991-08-01), Cairncross et al.
patent: 5330587 (1994-07-01), Gavigan et al.
patent: 5375757 (1994-12-01), Covill
patent: 5478426 (1995-12-01), Wiler et al.
patent: 5521628 (1996-05-01), Montgomery
patent: 5674415 (1997-10-01), Leong et al.
patent: 5719376 (1998-02-01), Snyder et al.
patent: 5741559 (1998-04-01), Dulaney
patent: 5942289 (1999-08-01), Jackson
patent: 6013140 (2000-01-01), Simoneaux
patent: 6075223 (2000-06-01), Harrison
patent: 6159832 (2000-12-01), Mayer
patent: 6203633 (2001-03-01), Clauer et al.
patent: 6313436 (2001-11-01), Harrison
patent: 6422010 (2002-07-01), Julien
patent: 6508920 (2003-01-01), Ritzdorf et al.
patent: 2002/0079297 (2002-06-01), Harrison
patent: 2003/0089761 (2003-05-01), Costa
patent: 2003/0201059 (2003-10-01), Holman et al.
patent: 2004/0168752 (2004-09-01), Julien

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