LED mounting having increased heat dissipation

Details LED mounting having increased heat dissipation LED mounting having increased heat dissipation

2007-08-28

2007-08-28

Kebede, Brook (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

With reflector, opaque mask, or optical element integral...

C257S676000, C257SE33066, C438S122000

Reexamination Certificate

active

11075094

ABSTRACT:
There is disclosed a system and method for increasing heat dissipation of LED displays by using the current PCB packaging mounted to a LCD panel support structure thereby eliminating the need for a metal core PCB. In one embodiment, reverse mounted LEDs having heat dissipation pads are used to optimize heat transfer to a metal layer which is then placed in contact with the LCD support structure.

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UK Search Report dated Jul. 4, 2006 involving counterpart UK application No. GB0604614.8.

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