Semiconductor package with crossing conductor assembly and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

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C257S692000, C257S784000, C257S786000, C438S123000

Reexamination Certificate

active

11388646

ABSTRACT:
A semiconductor package uses various forms of conductive traces that connect to die bond pads via bond wires. In one form, adjacent bond wires are intentionally crossed around midpoints thereof to reduce self-inductance of the conductors and to minimize self-inductance. In another form, bond wires associated with bond pads having intervening, unrelated bond pads are crossed. Additionally, conductive traces are divided into separate sections and electrically connected by crossed jumper wires or bond wires. Any number of separate sections may be formed for each trace, but an even number is preferable. In another form, one trace is continuous and divides a second trace into two or more sections. The multiple sections are connected by an overlying bond wire. Either insulated or non-insulated bond wire may be used.

REFERENCES:
patent: 5004317 (1991-04-01), Jackson et al.
patent: 6031281 (2000-02-01), Kang et al.
patent: 6177726 (2001-01-01), Manteghi
patent: 6469260 (2002-10-01), Horuichi et al.
patent: 6894398 (2005-05-01), Pon
patent: 0 276 940 (1988-08-01), None
patent: WO 98/26452 (1998-06-01), None
patent: WO 02/080272 (2002-10-01), None

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