Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – Shaping against forming surface
Reexamination Certificate
2007-11-20
2007-11-20
Johnson, Christina (Department: 1732)
Plastic and nonmetallic article shaping or treating: processes
Mechanical shaping or molding to form or reform shaped article
Shaping against forming surface
C264S401000, C264SDIG057, C425S225000
Reexamination Certificate
active
10723762
ABSTRACT:
A method for three-dimensional modeling builds up three-dimensional objects in a heated build chamber by dispensing modeling material from a dispensing head onto a base in a predetermined pattern. Physical and thermal separation are maintained between the heated build chamber and motion control components that control the motion of the dispensing head and the base. Thermal isolation of the motion control components from the build chamber allows the chamber to be maintained at a high temperature, and has other practical advantages as well.
REFERENCES:
patent: 2117651 (1938-05-01), Caugherty
patent: 3016451 (1962-01-01), Cornell
patent: 3381812 (1968-05-01), Cohen
patent: 3472452 (1969-10-01), Beeston, Jr.
patent: 3494853 (1970-02-01), Anderson et al.
patent: 3841000 (1974-10-01), Simon
patent: 3917090 (1975-11-01), Montagnino
patent: 4152367 (1979-05-01), Binsack et al.
patent: 4665492 (1987-05-01), Masters
patent: 4749347 (1988-06-01), Valavaara
patent: 4844373 (1989-07-01), Fike, Sr.
patent: 4898314 (1990-02-01), Stroh
patent: 4928897 (1990-05-01), Satou et al.
patent: 4961154 (1990-10-01), Pomerantz et al.
patent: 5059266 (1991-10-01), Yamane et al.
patent: 5120476 (1992-06-01), Scholz
patent: 5121329 (1992-06-01), Crump
patent: 5134569 (1992-07-01), Masters
patent: 5136515 (1992-08-01), Helinski
patent: 5140937 (1992-08-01), Yamane et al.
patent: 5142211 (1992-08-01), Tan
patent: 5149548 (1992-09-01), Yamane et al.
patent: 5169081 (1992-12-01), Goedderz
patent: 5204055 (1993-04-01), Sachs et al.
patent: 5216616 (1993-06-01), Masters
patent: 5257657 (1993-11-01), Gore
patent: 5260009 (1993-11-01), Penn
patent: 5263585 (1993-11-01), Lawhon et al.
patent: 5293996 (1994-03-01), Duncan
patent: 5303141 (1994-04-01), Batchelder et al.
patent: 5312224 (1994-05-01), Batchelder et al.
patent: 5340433 (1994-08-01), Crump
patent: 5402351 (1995-03-01), Batchelder et al.
patent: 5474719 (1995-12-01), Fan et al.
patent: 5503785 (1996-04-01), Crump et al.
patent: 5581994 (1996-12-01), Reiss et al.
patent: 5587913 (1996-12-01), Abrams et al.
patent: 5594652 (1997-01-01), Penn et al.
patent: 5695707 (1997-12-01), Almquist et al.
patent: 5738817 (1998-04-01), Danforth et al.
patent: 5764521 (1998-06-01), Batchelder et al.
patent: 5765740 (1998-06-01), Ferguson
patent: 5807437 (1998-09-01), Sachs et al.
patent: 5866058 (1999-02-01), Batchelder et al.
patent: 5893404 (1999-04-01), Mendez et al.
patent: 5900207 (1999-05-01), Danforth et al.
patent: 5932055 (1999-08-01), Newell et al.
patent: 5939008 (1999-08-01), Comb et al.
patent: 5943235 (1999-08-01), Earl et al.
patent: 5968561 (1999-10-01), Batchelder et al.
patent: 6004124 (1999-12-01), Swanson et al.
patent: 6022207 (2000-02-01), Dahlin et al.
patent: 6027068 (2000-02-01), Lantsman
patent: 6054077 (2000-04-01), Comb et al.
patent: 6067480 (2000-05-01), Stuffle et al.
patent: 6070107 (2000-05-01), Lombardi et al.
patent: 6085957 (2000-07-01), Zinniel et al.
patent: 6095323 (2000-08-01), Ferguson
patent: 6119567 (2000-09-01), Schindler et al.
patent: 6127492 (2000-10-01), Nagashima et al.
patent: 6129872 (2000-10-01), Jang
patent: 6133355 (2000-10-01), Leyden et al.
patent: 6162378 (2000-12-01), Bedal et al.
patent: 6165406 (2000-12-01), Jang et al.
patent: 6175422 (2001-01-01), Penn et al.
patent: 6193923 (2001-02-01), Leyden et al.
patent: 6214279 (2001-04-01), Yang et al.
patent: 6228923 (2001-05-01), Lombardi et al.
patent: 6257517 (2001-07-01), Babish et al.
patent: 6322728 (2001-11-01), Brodkin et al.
patent: 6572228 (2003-06-01), Kaga et al.
patent: 6645412 (2003-11-01), Priedeman, Jr. et al.
patent: 6685866 (2004-02-01), Swanson et al.
patent: 6722872 (2004-04-01), Swanson et al.
patent: 6730252 (2004-05-01), Teoh et al.
patent: 6790403 (2004-09-01), Priedeman, Jr. et al.
patent: WO 00/62994 (2000-10-01), None
patent: WO 00/78519 (2000-12-01), None
patent: WO 02/06029 (2002-01-01), None
patent: WO 02/93360 (2002-11-01), None
patent: WO 04/003823 (2004-08-01), None
Paper entitled “High Temperature Fused Deposition Modelling: An Experimental Study Focusing on Modelling Materials”, by F.K. Feenstra, from Time-Compression Technologies '98 Conference (Oct. 13-14, 1998, Nottingham, U.K.).
Karwoski Peter J.
LaBossiere Joseph E.
Leavitt Paul J.
Skubic Robert L.
Swanson William J.
Daniels Matthew J.
Johnson Christina
Kinney & Lange , P.A.
Stratasys Inc.
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