Method and system for sealing a substrate

Details Method and system for sealing a substrate Method and system for sealing a substrate

2007-08-21

2007-08-21

Nhu, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S780000, C257SE23128, C257SE21502, C257SE21503, C257SE21509, C257SE21511

Reexamination Certificate

active

11089769

ABSTRACT:
A method of sealing a microelectromechanical system (MEMS) device from ambient conditions is described, wherein the MEMS device is formed on a substrate and a substantially hermetic seal is formed as part of the MEMS device manufacturing process. The method comprises forming a metal seal on the substrate proximate a perimeter of the MEMS device using a method such as photolithography. The metal seal is formed on the substrate while the MEMS device retains a sacrificial layer between conductive members of MEMS elements, and the sacrificial layer is removed after formation of the seal and prior to attachment of a backplane.

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