Method for production of semiconductor package

Details Method for production of semiconductor package Method for production of semiconductor package

2007-08-28

2007-08-28

Smith, Matthew (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C439S083000, C439S084000, C029S830000, C029S843000, C029S844000, C029S845000

Reexamination Certificate

active

11113267

ABSTRACT:
A method for production of a semiconductor package which enables uniform conduction processing for all through holes covered by the conduction processing without being limited to any specific structure, is free from surface relief shapes and internal voids, and enables conduction processing simply, in a short time, at a low cost utilizing existingfacilities, wherein the conduction processing of the through holes includes a step of press fitting a conductor into the through holes by a ball bonder and a step of flattening the exposed heads of the press-fit conductors by coining.

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