Method and system for compensating thermally induced motion...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C324S760020

Reexamination Certificate

active

11428423

ABSTRACT:
A method and system for compensating for thermally induced motion of probe cards used in testing die on a wafer are disclosed. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced movement of the probe card is disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.

REFERENCES:
patent: 3963985 (1976-06-01), Geldermans
patent: 4755747 (1988-07-01), Sato
patent: 4780836 (1988-10-01), Miyazaki et al.
patent: 5124639 (1992-06-01), Carlin et al.
patent: 5198752 (1993-03-01), Miyata et al.
patent: 5410259 (1995-04-01), Fujihara et al.
patent: 5521523 (1996-05-01), Kimura et al.
patent: 5550480 (1996-08-01), Nelson et al.
patent: 5550482 (1996-08-01), Sano
patent: 5604446 (1997-02-01), Sano
patent: 5640101 (1997-06-01), Kuji et al.
patent: 5644245 (1997-07-01), Saitoh et al.
patent: 5861759 (1999-01-01), Bialobrodski et al.
patent: 5936418 (1999-08-01), Ideta et al.
patent: 5974662 (1999-11-01), Eldridge et al.
patent: 6043668 (2000-03-01), Carney
patent: 6043671 (2000-03-01), Mizuta
patent: 6064215 (2000-05-01), Kister
patent: 6137299 (2000-10-01), Cadieux et al.
patent: 6140828 (2000-10-01), Iino et al.
patent: 6184053 (2001-02-01), Eldridge et al.
patent: 6441629 (2002-08-01), Khoury et al.
patent: 6580282 (2003-06-01), Lieutard et al.
patent: 6605954 (2003-08-01), Nagar
patent: 6674627 (2004-01-01), Kund
patent: 6710615 (2004-03-01), Miki
patent: 6927587 (2005-08-01), Yoshioka
patent: 6972578 (2005-12-01), Martens et al.
patent: 7002363 (2006-02-01), Mathieu
patent: 7071714 (2006-07-01), Eldridge et al.
patent: 7119564 (2006-10-01), Martens et al.
patent: 2006/0259814 (2006-11-01), Eldridge et al.
patent: 1098200 (2001-05-01), None
patent: 2780792 (1998-07-01), None
patent: 61-150346 (1986-07-01), None
patent: 02-264868 (1989-04-01), None
patent: 04-280445 (1992-06-01), None
patent: 04-273458 (1992-09-01), None
patent: 04-333250 (1992-11-01), None
patent: 04-361543 (1992-12-01), None
patent: 05-264590 (1993-10-01), None
patent: 09-005358 (1997-01-01), None
patent: 11-51972 (1999-02-01), None
patent: 263558 (1994-10-01), None
patent: 332863 (1998-06-01), None
patent: 460698 (2001-10-01), None
patent: WO 01/69274 (2001-09-01), None
U.S. Appl. No. 11/548,183, filed Oct. 10, 2006, Martens et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and system for compensating thermally induced motion... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and system for compensating thermally induced motion..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and system for compensating thermally induced motion... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3830427

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.