Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-08-28
2007-08-28
Dinh, Tuan T. (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S794000, C361S803000, C174S267000
Reexamination Certificate
active
11443046
ABSTRACT:
A multilayer printed wiring board10includes: a build-up layer30that is formed on a core substrate20and has a conductor pattern32disposed on an upper surface; a low elastic modulus layer40that is formed on the build-up layer30;lands52that are disposed on an upper surface of the low elastic modulus layer40and connected via solder bumps66to a IC chip70;and conductor posts50that pass through the low elastic modulus layer40and electrically connect lands52with conductor patterns32.The conductor posts50have the aspect ratio Rasp (height/minimum diameter) of not less than 4 and the minimum diameter exceeding 30 μm, and the aspect ratio Rasp of external conductor posts50a, which are positioned at external portions of the low elastic modulus layer40,is greater than or equal to the aspect ratio Rasp of internal conductor posts50b, which are positioned at internal portions of the low elastic modulus layer40.
REFERENCES:
patent: 5509203 (1996-04-01), Yamashita
patent: 5699613 (1997-12-01), Chong et al.
patent: 5916453 (1999-06-01), Beilin et al.
patent: 6384344 (2002-05-01), Asai et al.
patent: 6428942 (2002-08-01), Jiang et al.
patent: 6847527 (2005-01-01), Sylvester et al.
patent: 2006/0180341 (2006-08-01), Kariya et al.
patent: 2006/0231290 (2006-10-01), Kariya et al.
patent: 58-028848 (1983-02-01), None
patent: 05-047842 (1993-02-01), None
patent: 2001-036523 (2001-02-01), None
patent: 2001-298272 (2001-10-01), None
patent: 2003-077920 (2003-03-01), None
patent: 2003-133477 (2003-05-01), None
U.S. Appl .No. 11/415,117, filed May 2, 2006, Kariya et al.
Furutani Toshiki
Kariya Takashi
Dinh Tuan T.
Ibiden Co. Ltd.
LandOfFree
Multilayer printed wiring board does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Multilayer printed wiring board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer printed wiring board will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3830008