Surface mount chip capacitor

Details Surface mount chip capacitor Surface mount chip capacitor

2007-10-16

2007-10-16

Ha, Nguyen T. (Department: 2831)

Electricity: electrical systems and devices

Electrolytic systems or devices

Solid electrolytic capacitor

C361S525000, C361S528000, C361S529000, C361S516000, C361S508000, C029S025010, C029S025030

Reexamination Certificate

active

11293673

ABSTRACT:
A surface mount chip capacitor includes a metal substrate, a conductive powder element including a valve metal and partially surrounding the metal substrate with the metal substrate extending outwardly from the conductive powder towards the anode end of the surface mount chip capacitor, a silver body cathode at least partially surrounding the conductive powder element, a coating formed by vapor-phase deposition surrounding the silver body cathode, an insulative material formed about a portion of the substrate extending outwardly from the conductive powder, a conductive coating formed around the metal substrate at the anode end of the surface mount chip capacitor, an end termination anode electrically connected to the conductive coating at the anode end of the surface mount chip capacitor, and an end termination cathode electrically connected to the silver body cathode at the cathode end of the surface mount chip capacitor.

REFERENCES:
patent: 6380577 (2002-04-01), Cadwallader
patent: 6449140 (2002-09-01), Sakai et al.
patent: 6529366 (2003-03-01), Nakamura
patent: 6791822 (2004-09-01), Kochi et al.
patent: 7085127 (2006-08-01), Goldberger et al.
patent: 7144432 (2006-12-01), Nakamura
patent: 2003/0099084 (2003-05-01), Duva
patent: 2005/0195558 (2005-09-01), Goldberger et al.
patent: 1 505 611 (2005-02-01), None
PCT/US2006/031123 International Search Report, Vishay Sprague, Inc., filed Oct. 8, 2006, pp. 1-6.

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