Semiconductor device and method for fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Heterojunction device – Field effect transistor

Reexamination Certificate

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C257S194000

Reexamination Certificate

active

11193417

ABSTRACT:
In the structure of a semiconductor device of the present invention, a first source electrode is connected to a conductive substrate through a via hole, and a second source electrode is formed. Thus, even if a high reverse voltage is applied between a gate electrode and a drain electrode, electric field concentration likely to occur at an edge of the gate electrode closer to the drain electrode can be effectively dispersed or relaxed. Moreover, the conductive substrate is used as a substrate for forming element formation layers, so that a via hole penetrating the substrate to reach the backside thereof does not have to be formed in the conductive substrate. Thus, with the strength necessary for the conductive substrate maintained, the first source electrode can be electrically connected to a backside electrode.

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patent: 2005/0274977 (2005-12-01), Saito et al.
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patent: WO 00/48248 (2000-08-01), None
patent: WO 2004/068590 (2004-08-01), None
Fukuda et al., “GaAs Field-Effect Transistors”, The IEICE, 1992 pp. 213-215.
Ando et al. “Characterization of High Breakdown Voltage AlGaN/GaN Heterojunction FETs with a Field Plate Gate”, Technical Report of IEICE, ED2002-214, CMP 2002-105 (Oct. 2002) pp. 29-34.
Saito W et al “600V AlGaN/GaN Power-HEMT: Design, Fabrication and Demonstration on High Voltage DC—DC Converter” IEEE US Dec. 8, 2003, pp. 587-590.
Thompson R et al “Performance of the ALGAN HEMT Structure With A Gate Extension” IEEE Transactions on Electron Devicees, IEEE Service Center, Pisacataway, NJ, US<vol. 51, No. 2, Feb. 2004.

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