Device providing electrical contact to the surface of a...

Chemistry: electrical and wave energy – Apparatus – Electrolytic

Reexamination Certificate

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C205S087000, C205S123000, C205S147000

Reexamination Certificate

active

10826219

ABSTRACT:
Substantially uniform deposition of conductive material on a surface of a substrate, which substrate includes a semiconductor wafer, from an electrolyte containing the conductive material can be provided by way of a particular device which includes first and second conductive elements. The first conductive element can have multiple electrical contacts, of identical or different configurations, or may be in the form of a conductive pad, and can contact or otherwise electrically interconnect with the substrate surface over substantially all of the substrate surface. Upon application of a potential between the first and second conductive elements while the electrolyte makes physical contact with the substrate surface and the second conductive element, the conductive material is deposited on the substrate surface. It is possible to reverse the polarity of the voltage applied between the anode and the cathode so that electro-etching of deposited conductive material can be performed.

REFERENCES:
patent: 2540602 (1951-02-01), Thomas et al.
patent: 2708181 (1955-05-01), Holmes et al.
patent: 3328273 (1967-06-01), Creutz et al.
patent: 4339319 (1982-07-01), Aigo
patent: 4430173 (1984-02-01), Boudot et al.
patent: 4713149 (1987-12-01), Hoshino
patent: 4948474 (1990-08-01), Miljkovic
patent: 4954142 (1990-09-01), Carr et al.
patent: 4975159 (1990-12-01), Dahms
patent: 5084071 (1992-01-01), Nenadic et al.
patent: 5256565 (1993-10-01), Bernhardt et al.
patent: 5354490 (1994-10-01), Yu et al.
patent: 5466161 (1995-11-01), Yumibe et al.
patent: 5472592 (1995-12-01), Lowery
patent: 5516412 (1996-05-01), Andricacos et al.
patent: 5567300 (1996-10-01), Datta et al.
patent: 5681215 (1997-10-01), Sherwood et al.
patent: 5755859 (1998-05-01), Brusic et al.
patent: 5762544 (1998-06-01), Zuniga et al.
patent: 5770095 (1998-06-01), Saski et al.
patent: 5773364 (1998-06-01), Farkas et al.
patent: 5793272 (1998-08-01), Burghartz et al.
patent: 5795215 (1998-08-01), Guthrie et al.
patent: 5807165 (1998-09-01), Uzoh et al.
patent: 5840629 (1998-11-01), Carpio
patent: 5858813 (1999-01-01), Scherber et al.
patent: 5862605 (1999-01-01), Horie et al.
patent: 5884990 (1999-03-01), Burghartz et al.
patent: 5897375 (1999-04-01), Watts et al.
patent: 5911619 (1999-06-01), Uzoh et al.
patent: 5922091 (1999-07-01), Tsai et al.
patent: 5930669 (1999-07-01), Uzoh
patent: 5933753 (1999-08-01), Simon et al.
patent: 5954997 (1999-09-01), Kaufman et al.
patent: 5985123 (1999-11-01), Koon
patent: 6004880 (1999-12-01), Liu et al.
patent: 6027631 (2000-02-01), Broadbent
patent: 6063506 (2000-05-01), Andricacos et al.
patent: 6066030 (2000-05-01), Uzoh
patent: 6071388 (2000-06-01), Uzoh
patent: 6074544 (2000-06-01), Reid et al.
patent: 6103085 (2000-08-01), Woo et al.
patent: 6106680 (2000-08-01), Nogami et al.
patent: 6132586 (2000-10-01), Adams et al.
patent: 6132587 (2000-10-01), Jorne et al.
patent: 6136163 (2000-10-01), Cheung et al.
patent: 6143155 (2000-11-01), Adams et al.
patent: 6153064 (2000-11-01), Condra et al.
patent: 6176992 (2001-01-01), Talieh
patent: 6187152 (2001-02-01), Ting et al.
patent: 6228231 (2001-05-01), Uzoh
patent: 6251235 (2001-06-01), Talieh et al.
patent: 6251236 (2001-06-01), Stevens
patent: 6270646 (2001-08-01), Walton et al.
patent: 6299741 (2001-10-01), Sun et al.
patent: 6334937 (2002-01-01), Batz et al.
patent: 6379223 (2002-04-01), Sun et al.
patent: 6402925 (2002-06-01), Talieh
patent: 6440295 (2002-08-01), Wang
patent: 6471847 (2002-10-01), Talieh et al.
patent: 6482307 (2002-11-01), Ashjaee et al.
patent: 6497800 (2002-12-01), Talieh et al.
patent: 6506103 (2003-01-01), Ohmori et al.
patent: 6534116 (2003-03-01), Basol
patent: 6537144 (2003-03-01), Tsai et al.
patent: 6600229 (2003-07-01), Mukherjee et al.
patent: 6610190 (2003-08-01), Basol et al.
patent: 6630059 (2003-10-01), Uzoh et al.
patent: 6653226 (2003-11-01), Reid
patent: 6676822 (2004-01-01), Talieh
patent: 6848970 (2005-02-01), Manens et al.
patent: 6855239 (2005-02-01), Jairath
patent: 6902659 (2005-06-01), Talieh
patent: 6942780 (2005-09-01), Basol et al.
patent: 6958114 (2005-10-01), Talieh et al.
patent: 2002/0074238 (2002-06-01), Mayer et al.
patent: 2002/0102853 (2002-08-01), Li
patent: 2003/0054729 (2003-03-01), Lee et al.
patent: 2003/0226764 (2003-12-01), Moore et al.
patent: 2004/0178060 (2004-09-01), Ravkin et al.
patent: 11279797 (1999-10-01), None
patent: WO 98/27585 (1998-06-01), None
patent: WO 00/26443 (2000-05-01), None
Co-Pending U.S. Appl. No. 10/302,213, filed Nov. 22, 2002.
Co-Pending U.S. Appl. No. 10/459,320, filed Jun. 10, 2003.
Co-Pending U.S. Appl. No. 10/459,321, filed Jun. 10, 2003.
Co-Pending U.S. Appl. No. 10/459,323, filed Jun. 10, 2003.
Co-Pending U.S. Appl. No. 10/123,268, filed May 5, 2005.
Robert D. Mikkola et al., “Investigation of the Roles of the Additive Components for Secod Generation Copper Electroplating Chemistries Used for Advanced Interconnect Metalization”, 2000 IEEE, IEEE Electron Devices Society, pp. 117-119, Jun. 2000.
James J. Kelly et al., “Leveling and Microstructural Effects of Additives for Copper Electrodeposition”, Journal of Electrochemical Society, 146 (7), 1999, pp. 2540-2545.
Joseph m. Steigerwald et al., “Chemical Mechanical Planarization of Microelectronic Materials”, A Wiley-Interscience Publication, 1997 by John Wiley & Sons, Inc. pp. 212-222.
Robert D. Mikkola et al., “Investigation of the Roles of the Additive Components for Second Generation Copper Electroplating Chemistries Used for Advanced Interconnect Metalization”, 2000 IEEE, IEEE Electron Devices Society, pp. 117-119, Jun. 2000. In related U.S. Appl. No. 09/685,934.
James J. Kelly et al., “Leveling and Microstructural Effects of Addictives for Copper Electrodeposition”, Journal of Electrochemical Socirty, 146 (7), 1999, pp. 2540-2545. In related U.S. Appl. No. 09/685,934.
Joseph M. Steigerwald et al., “Chemical Mechanical Planarization of MicroelectronicMaterials”, A Wiley-Interscience Publication, 1997 by John Wiley & Sons, Inc. pp. 212-222. In related U.S. Appl. No. 09/685,934.

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