Thermal imaging paper laminate

Details Thermal imaging paper laminate Thermal imaging paper laminate

2007-02-27

2007-02-27

Nguyen, Hung (Department: 2612)

Communications: electrical

Condition responsive indicating system

Specific condition

C340S572100, C340S572400, C340S572700, C340S571000, C340S568100

Reexamination Certificate

active

11036042

ABSTRACT:
A thermal imaging paper having a laminate structure is disclosed. The laminate structure includes a thermal imaging heat sensitive substrate, an adhesive layer, and a polyfoam layer. In addition, a security feature such as an antenna and integrated circuit are provided in a position interposed between said adhesive layer and said thermal imaging heat sensitive substrate. The thermal imaging paper provides the combination of an effective thermal imaging paper product incorporating the benefits of a security feature such as a wireless memory device.

REFERENCES:
patent: 3539375 (1970-11-01), Baum
patent: 3674535 (1972-07-01), Blose et al.
patent: 3746675 (1973-07-01), Blose et al.
patent: 4151748 (1979-05-01), Baum
patent: 4181771 (1980-01-01), Hanson et al.
patent: 4246318 (1981-01-01), Baum
patent: 4470057 (1984-09-01), Glanz
patent: 4642263 (1987-02-01), Culbertson
patent: 5821196 (1998-10-01), Schulz et al.
patent: 5982284 (1999-11-01), Baldwin et al.
patent: 6100804 (2000-08-01), Brady et al.
patent: 6147604 (2000-11-01), Wiklof et al.
patent: 6265977 (2001-07-01), Vega et al.
patent: 6369711 (2002-04-01), Adams et al.
patent: 6395373 (2002-05-01), Conti et al.
patent: 6404341 (2002-06-01), Reid
patent: 6951596 (2005-10-01), Green et al.

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