Heat exchange – Structural installation – Heating and cooling
Reexamination Certificate
2007-02-27
2007-02-27
Ciric, Ljiljana (Department: 3753)
Heat exchange
Structural installation
Heating and cooling
C118S719000, C118S724000, C118S725000
Reexamination Certificate
active
09906130
ABSTRACT:
A heating and cooling apparatus with which batch processing is possible and throughput can be increased, and furthermore which is more compact and uses less energy. A substrate heating chamber and a substrate cooling chamber each capable of simultaneously holding a plurality of substrates are provided in a thermally separated state in a heating and cooling apparatus with a single vacuum processing chamber. The substrate heating chamber is equipped with a plurality of communicating or non-communicating substrate holding spaces. The substrate cooling chamber is also equipped with a plurality of communicating or non-communicating substrate holding spaces. The communicating substrate holding spaces allow the batch heat treatment of substrates, while the non-communicating substrate holding spaces allow the batch or individual processing of substrates.
REFERENCES:
patent: 2382432 (1945-08-01), McManus et al.
patent: 4047624 (1977-09-01), Dorenbos
patent: 4313254 (1982-02-01), Feldman et al.
patent: 4461783 (1984-07-01), Yamazaki
patent: 4519339 (1985-05-01), Izu et al.
patent: 4666734 (1987-05-01), Kamiya et al.
patent: 5258075 (1993-11-01), Kurokawa
patent: 5324360 (1994-06-01), Kozuka
patent: 5474410 (1995-12-01), Ozawa et al.
patent: 5512320 (1996-04-01), Turner et al.
patent: 5571749 (1996-11-01), Matsuda et al.
patent: 5607009 (1997-03-01), Turner et al.
patent: 5799860 (1998-09-01), Demaray et al.
patent: 6139695 (2000-10-01), Washburn et al.
patent: 6235634 (2001-05-01), White et al.
patent: 6277199 (2001-08-01), Lei et al.
patent: 6338874 (2002-01-01), Law et al.
patent: 6444277 (2002-09-01), Law et al.
patent: 6688375 (2004-02-01), Turner et al.
patent: 2003/0029833 (2003-02-01), Johnson
patent: 06-287754 (1994-11-01), None
patent: 2000119848 (2000-04-01), None
Koguchi Toshiaki
Takahashi Nobuyuki
Watanabe Kazuhito
Anelva Corporation
Burdett James R.
Ciric Ljiljana
Venable LLP
LandOfFree
Heating and cooling apparatus, and vacuum processing... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heating and cooling apparatus, and vacuum processing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heating and cooling apparatus, and vacuum processing... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3826821