Semiconductor chip package and manufacturing method thereof

Details Semiconductor chip package and manufacturing method thereof Semiconductor chip package and manufacturing method thereof

2007-11-13

2007-11-13

Clark, S. V. (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C438S108000

Reexamination Certificate

active

11387690

ABSTRACT:
An acceleration sensor chip package comprises a frame section, a first semiconductor chip corresponding to an MEMS chip having a plurality of first bumps, a second semiconductor chip having a plurality of second bumps, a substrate on which the first and second semiconductor chips are mounted in parallel with each other and which has a plurality of electrode pads directly connected to the first or second bumps in opposing relationship to the first or second bumps, and external terminals respectively connected to the electrode pads, a closed ring-shaped first sealing section which seals a space defined between the frame section and the substrate so as to surround arrangements of the plurality of first bumps, and a second sealing section which covers the first semiconductor chip, the second semiconductor chip and the first sealing section to seal them.

REFERENCES:
patent: 6638789 (2003-10-01), Glenn et al.
patent: 7183622 (2007-02-01), Heck et al.
patent: 7230331 (2007-06-01), Chen et al.

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