Method for forming film, method for forming wiring pattern,...

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C156S247000, C438S478000, C438S689000, C430S201000

Reexamination Certificate

active

10933438

ABSTRACT:
Exemplary embodiments of the invention to provide an efficient and productive method to form a reliable film. A method to form a film according to exemplary embodiments of the present invention, in which a transferring layer formed on a substrate is transferred to a workpiece to form a predetermined film on the workpiece, includes treating a surface of the workpiece to enhance or improve the adhesion between the transferring layer and the workpiece by chemical interaction.

REFERENCES:
patent: 2297691 (1942-10-01), Carlson
patent: 4411735 (1983-10-01), Belani
patent: 4804600 (1989-02-01), Kato et al.
patent: 4942110 (1990-07-01), Genovese et al.
patent: 5147397 (1992-09-01), Christ et al.
patent: 5171650 (1992-12-01), Ellis et al.
patent: 5685939 (1997-11-01), Wolk et al.
patent: 5997677 (1999-12-01), Zaher
patent: 6274508 (2001-08-01), Jacobsen et al.
patent: 6291126 (2001-09-01), Wolk et al.
patent: 2002/0037481 (2002-03-01), Lee et al.
patent: 2003/0146019 (2003-08-01), Hirai
patent: 10208881 (1998-08-01), None
patent: A 10-208881 (1998-08-01), None
patent: 2001-168061 (2001-06-01), None
patent: 2001168061 (2001-06-01), None
patent: A 2001-249342 (2001-09-01), None
patent: 9505623 (1995-02-01), None
patent: WO 9505623 (1995-02-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for forming film, method for forming wiring pattern,... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for forming film, method for forming wiring pattern,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for forming film, method for forming wiring pattern,... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3819458

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.