Semiconductor chip assemblies, methods of making same and...

Details Semiconductor chip assemblies, methods of making same and... Semiconductor chip assemblies, methods of making same and...

2007-11-06

2007-11-06

Graybill, David E (Department: 2827)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S737000, C257S773000, C257S783000, C438S117000, C438S118000, C438S126000, C438S613000, C438S052000

Reexamination Certificate

active

10164116

ABSTRACT:
Semiconductor chip assemblies incorporating flexible, sheet-like elements having terminals thereon overlying the front or rear face of the chip to provide a compact unit. The terminals on the sheet-like element are movable with respect to the chip, so as to compensate for thermal expansion. A resilient element such as a compliant layer interposed between the chip and terminals permits independent movement of the individual terminals toward the chip driving engagement with a test probe assembly so as to permit reliable engagement despite tolerances.

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