Semiconductor device with a multi-level interconnect...

Details Semiconductor device with a multi-level interconnect... Semiconductor device with a multi-level interconnect...

2007-02-13

2007-02-13

Ha, Nathan W. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

Reexamination Certificate

active

10716948

ABSTRACT:
A semiconductor device includes a semiconductor die and a multi-level interconnect structure that has a first insulating layer formed on the die, conductive horizontal bodies, each of which is connected to a respective bonding pad of the die and has an extension formed on the first insulating layer, a second insulating layer formed on the first insulating layer, and conductive vertical bodies, each of which is connected to the extension of a respective conductive horizontal body and extends through the second insulating layer.

REFERENCES:
patent: 6175159 (2001-01-01), Sasaki
patent: 6713859 (2004-03-01), Ma

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