Hot melt adhesive composition

Details Hot melt adhesive composition Hot melt adhesive composition

2007-01-23

2007-01-23

Szekely, Peter (Department: 1714)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

C524S272000, C524S487000, C524S489000

Reexamination Certificate

active

10680276

ABSTRACT:
A low application temperature, high heat resistant hot melt adhesive comprising an ethylene n-butyl acrylate copolymer having a melt index (MI) of 750 grams/10 minutes or higher and an ethylene vinyl acetate (EVA) polymer having a MI of 750 grams/10 minutes or higher are particularly well suited for case and carton sealing operations.

REFERENCES:
patent: 4956207 (1990-09-01), Kauffman
patent: 5340863 (1994-08-01), Krutzel
patent: 5500472 (1996-03-01), Liedermooy et al.
patent: 5670566 (1997-09-01), Liedermooy et al.
patent: 5763516 (1998-06-01), Godfrey
patent: 6117945 (2000-09-01), Mehaffy et al.
patent: 6593407 (2003-07-01), Haner et al.
patent: 2002/0146526 (2002-10-01), Brian et al.
patent: 2004/0162396 (2004-08-01), Chu et al.
patent: 0 721 006 (1996-10-01), None
patent: 0 803 559 (1997-10-01), None
patent: 0 934 990 (1999-08-01), None
patent: 1 099 742 (2001-05-01), None
patent: 11 323279 (1999-11-01), None

Affiliated with

Also associated with

Rating

Hot melt adhesive composition does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Hot melt adhesive composition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hot melt adhesive composition will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3815277