Semiconductor device with connections for bump electrodes

Details Semiconductor device with connections for bump electrodes Semiconductor device with connections for bump electrodes

2007-02-20

2007-02-20

Munson, Gene M. (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

Reexamination Certificate

active

10866195

ABSTRACT:
A semiconductor device includes a passivity film, an insulating film and an encapsulating layer, all of which are formed, in this order, on the surface of a semiconductor substrate provided with a connecting pad, and a bump electrode electrically connected to the connecting pad via a wiring passing through a first opening defined in the passivation film and a second opening defined in the insulating film. The bump electrode has a leading end portion exposed from the surface of the encapsulating layer. In the semiconductor device, all of a section of the first opening and all of a section of the second opening as viewed from the direction normal to the surface of the semiconductor substrate are set so as to be contained within a section of the bump electrode as viewed from the direction

REFERENCES:
patent: 6075290 (2000-06-01), Schaefer et al.
patent: 2002-93945 (2002-03-01), None

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