Method and apparatus for pad aligned multiprobe wafer testing

Details Method and apparatus for pad aligned multiprobe wafer testing Method and apparatus for pad aligned multiprobe wafer testing

2007-02-27

2007-02-27

Nguyen, Ha Tran (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

Reexamination Certificate

active

11360418

ABSTRACT:
A control unit of a wafer prober for implementing wafer examination, using a probe card including a multiple number of probes, executes a multiple number of measuring operations by bringing the probes of the probe card into contact with bonding pads formed on a wafer and by measuring the electric characteristics between predetermined pads of the bonding pads, each of the measuring operations being implemented after varying the relative position between the probe card and the wafer, in directions parallel to the face of the wafer. The control unit, upon execution of each of the measuring operations, implements the measuring operation after adjusting the relative position between the probe card and the wafer so that the contact position of each probe of the probes against each pad of the bonding pads is separated from all the positions at which the probes have already touched that pad of the bonding pads for a predetermined number of different times.

REFERENCES:
patent: 5521522 (1996-05-01), Abe et al.
patent: 5525912 (1996-06-01), Momohara
patent: 60-117638 (1985-06-01), None

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