Method of forming silicon carbide films

Coating processes – Direct application of electrical – magnetic – wave – or... – Electrostatic charge – field – or force utilized

Reexamination Certificate

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C427S573000, C427S574000, C427S577000, C427S578000

Reexamination Certificate

active

10414467

ABSTRACT:
A method for depositing a silicon carbide layer onto a substrate comprises providing a silicon and carbon source gas and an inert gas into a reaction zone. The reaction zone contains the substrate. The method further comprises producing an electric field in the reaction zone. The electric field is generated using low and high frequency RF energy produced by an RF power supply. The RF power supply generates power at an electrode surface used for plasma discharge in the reaction zone. The method further comprises reacting the silicon and carbon source gas to deposit a silicon carbide film on the substrate. The RF power supply generates high energy RF power and low energy RF power during a processing period.

REFERENCES:
patent: 5500102 (1996-03-01), Ichikawa et al.
patent: 5800878 (1998-09-01), Yao
patent: 5888414 (1999-03-01), Collins et al.
patent: 5983828 (1999-11-01), Savas
patent: 6100184 (2000-08-01), Zhao et al.
patent: 6129806 (2000-10-01), Kaji et al.
patent: 6140226 (2000-10-01), Grill et al.
patent: 6177364 (2001-01-01), Huang
patent: 6187691 (2001-02-01), Fukuda et al.
patent: 6211077 (2001-04-01), Shimizu et al.
patent: 6211092 (2001-04-01), Tang et al.
patent: 6235112 (2001-05-01), Satoh
patent: 6242278 (2001-06-01), Shimizu et al.
patent: 6277201 (2001-08-01), Nishikawa
patent: 6287990 (2001-09-01), Cheung et al.
patent: 6340435 (2002-01-01), Bjorkman et al.
patent: 6358573 (2002-03-01), Raoux et al.
patent: 6383900 (2002-05-01), Shimizu et al.
patent: 6417092 (2002-07-01), Jain et al.
patent: 6465366 (2002-10-01), Nemani et al.
patent: 6524955 (2003-02-01), Fukuda et al.
patent: 6537928 (2003-03-01), Matsuki et al.
patent: 6541367 (2003-04-01), Mandal
patent: 6576564 (2003-06-01), Agarwal
patent: 6589888 (2003-07-01), Nemani et al.
patent: 6593247 (2003-07-01), Huang et al.
patent: 6627532 (2003-09-01), Gaillard et al.
patent: 6627535 (2003-09-01), Macneil et al.
patent: 6668752 (2003-12-01), Yao
patent: 6706142 (2004-03-01), Savas et al.
patent: 6759327 (2004-07-01), Xia et al.
patent: 6777349 (2004-08-01), Fu et al.
patent: 6815332 (2004-11-01), San et al.
patent: 7189658 (2007-03-01), Lakshmanan et al.
patent: 2001/0030369 (2001-10-01), MacNeil et al.
patent: 2001/0031563 (2001-10-01), Shioya et al.
patent: 2001/0051445 (2001-12-01), Shioya et al.
patent: 2002/0027286 (2002-03-01), Sundararajan et al.
patent: 2002/0054962 (2002-05-01), Huang
patent: 2002/0142578 (2002-10-01), Xia et al.
patent: 2004/0126929 (2004-07-01), Tang et al.
patent: 0 771 886 (1997-05-01), None
patent: 0 926 715 (1999-06-01), None
patent: 1191123 (2002-03-01), None
patent: 2001-060584 (2001-06-01), None

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