Process for cleaning electronic parts or precision parts

Details Process for cleaning electronic parts or precision parts Process for cleaning electronic parts or precision parts

1994-11-04

1996-06-04

Silbaugh, Jan H.

Cleaning and liquid contact with solids

Processes

Including regeneration, purification, recovery or separation...

134 26, 134 40, B08B 704, B08B 308

Patent

active

055229409

ABSTRACT:
Disclosed is a process for cleaning electronic parts or precision parts which comprises the steps of: washing the parts with a cleaning agent composition, rinsing the washed parts with water having a temperature of from 5.degree. to 100.degree. C., and maintaining the rinsing waste water at a temperature of 20.degree. C. or higher to effect separation of organic substances. The cleaning agent composition contains, as active cleaning components, a nonionic surface active agent and a compound selected from the group consisting of hydrocarbon compounds and slightly water soluble alkyl esters or alkyl ketones. The composition is such that 50% by weight or more of the organic substances separate from the water phase when the composition is made into an aqueous solution having an organic substance content of 5% by weight adjusted by diluting it with water or by evaporating water from it and the resulting cleaning agent aqueous solution is subsequently allowed to stand still for 30 minutes at a temperature of from 20.degree. to 100.degree. C.
According to the present invention, organic substances in rinsing waste water can be separated and removed efficiently, and subsequent waste water treatment step can be simplified. The process is economically advantageous, because the rinsing waste water after the separation treatment can be used again as a rinsing liquid.

REFERENCES:
patent: 4414128 (1983-11-01), Goffinet
patent: 4740247 (1988-04-01), Hayes et al.
patent: 4867800 (1989-09-01), Dishart et al.
patent: 4983224 (1991-01-01), Mombrun et al.
patent: 5096501 (1992-03-01), Dishart et al.
JP-A-54 149 330 Abstract.
Rep. Asahi Glass Found Ind. Technol., vol. 36, 1980, pp. 169-183, K. Shinoda, "How to Attain Very LowInterfacialTension at Oil-water interface?".

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