Method for producing a wiring transfer sheet

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C029S830000, C029S846000, C029S851000, C156S235000, C361S748000, C428S612000

Reexamination Certificate

active

10758129

ABSTRACT:
A wiring transfer sheet including a carrier base and a wiring layer formed thereon is produced so that an exposed area of a surface of the carrier base on which the wiring layer is formed has a plurality of concavities. By transferring the wiring layer to an electrically insulating substrate with this wiring transfer sheet, convexities which are complementary to the concavities are formed on the electrically insulating substrate. The convexities improve adhesion between a wiring board and a resin stacked thereon. Therefore, the wiring board thus obtained has surface coplanarity suitable for mounting a semiconductor bare chip and an electronic component as a whole, and a microscopical surface structure which adheres to a material stacked thereon.

REFERENCES:
patent: 3884771 (1975-05-01), Hanabusa et al.
patent: 4354895 (1982-10-01), Ellis
patent: 4649070 (1987-03-01), Kondo et al.
patent: 4867839 (1989-09-01), Sato et al.
patent: 4893404 (1990-01-01), Shirahata et al.
patent: 5021296 (1991-06-01), Suzuki et al.
patent: 5114543 (1992-05-01), Kajiwara et al.
patent: 5250363 (1993-10-01), Chen
patent: 5252383 (1993-10-01), Fukutake et al.
patent: 5346750 (1994-09-01), Hatakeyama et al.
patent: 5635301 (1997-06-01), Kondo et al.
patent: 5725706 (1998-03-01), Thoma et al.
patent: 6014929 (2000-01-01), Teng
patent: 6195882 (2001-03-01), Tsukamoto et al.
patent: 6197407 (2001-03-01), Andou et al.
patent: 6212769 (2001-04-01), Boyko et al.
patent: 6346335 (2002-02-01), Chen et al.
patent: 6359235 (2002-03-01), Hayashi
patent: 6406777 (2002-06-01), Boss et al.
patent: 6429114 (2002-08-01), Hayama et al.
patent: 2-113589 (1990-04-01), None
patent: 3-283696 (1991-12-01), None
patent: 6-268345 (1994-09-01), None
patent: 2000-77800 (2000-03-01), None
patent: 2000-77850 (2000-03-01), None
patent: 2000-154354 (2000-06-01), None
patent: 3172711 (2001-03-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for producing a wiring transfer sheet does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for producing a wiring transfer sheet, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for producing a wiring transfer sheet will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3806674

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.