Multi-stage low noise integrated object and system cooling...

Details Multi-stage low noise integrated object and system cooling... Multi-stage low noise integrated object and system cooling...

2007-05-08

2007-05-08

Chang, Yean-Hsi (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S701000

Reexamination Certificate

active

10617540

ABSTRACT:
A method and system are described for multi-stage cooling of a system, such as a computer system, and a high thermal dissipating object, such as a CPU, to minimize acoustic noise generated by the cooling system. The method includes causing at least one fan in a system to operate at high speeds during a first stage, and reducing the speed of at least one fan during an intermediary stage. The system includes a high thermal dissipating object, a heat sink connected to the high thermal dissipating object, a first fan to direct airflow on a main section of a heat sink during a first stage, and a second fan to direct airflow on an extended section of the heat sink. Optionally, a final stage may be entered into where all fans are shut off.

REFERENCES:
patent: 5926370 (1999-07-01), Cromwell
patent: 6191546 (2001-02-01), Bausch et al.
patent: 6766817 (2004-07-01), da Silva
patent: 7111667 (2006-09-01), Chang
patent: 0 860874 (1998-08-01), None

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