Radiant energy – Photocells; circuits and apparatus – With circuit for evaluating a web – strand – strip – or sheet
Reexamination Certificate
2007-09-11
2007-09-11
Epps, Georgia (Department: 2878)
Radiant energy
Photocells; circuits and apparatus
With circuit for evaluating a web, strand, strip, or sheet
C250S559300, C250S548000, C355S052000
Reexamination Certificate
active
11202707
ABSTRACT:
Techniques for determining wafer stage grid and yaw in a projection imaging tool are described. The techniques include exposing an overlay reticle onto a substrate having a recording media, thereby creating a plurality of printed fields on the substrate. The overlay reticle is then positioned such that when the reticle is exposed again completed alignment attributes are created in at least two sites in a first and a second printed field. The substrate is then rotated relative to the reticle by a desired amount. The overlay reticle is then positioned such that when the reticle is again exposed, completed alignment attributes are created in at least two sites in the first and a third printed field. Measurements of the complementary alignment attribute and a dynamic intra-field lens distortion are then used to reconstruct wafer stage grid and yaw error of the projection imaging system.
REFERENCES:
patent: 4861148 (1989-08-01), Santo et al.
patent: 5285236 (1994-02-01), Jain
patent: 5402224 (1995-03-01), Hirukawa et al.
patent: 5438413 (1995-08-01), Mazor et al.
patent: 5477058 (1995-12-01), Sato
patent: 5615006 (1997-03-01), Hirukawa et al.
patent: 5757507 (1998-05-01), Ausschnitt et al.
patent: 5770863 (1998-06-01), Nakasuji
patent: 5877861 (1999-03-01), Ausschnitt et al.
patent: 5894350 (1999-04-01), Hsieh et al.
patent: 6077756 (2000-06-01), Lin et al.
patent: 6079256 (2000-06-01), Bareket
patent: 6083650 (2000-07-01), Ogusu et al.
patent: 6093931 (2000-07-01), Sugihara et al.
patent: 6143621 (2000-11-01), Tzeng et al.
patent: 6153886 (2000-11-01), Hagiwara et al.
patent: 6204912 (2001-03-01), Tsuchiya et al.
patent: 6259525 (2001-07-01), David
patent: 6356343 (2002-03-01), Shiraishi et al.
patent: 6558852 (2003-05-01), Tawarayama et al.
patent: 6573986 (2003-06-01), Smith et al.
patent: 6734971 (2004-05-01), Smith et al.
patent: 6906303 (2005-06-01), Smith et al.
patent: 6906780 (2005-06-01), Smith et al.
patent: 6975974 (2005-12-01), Chien et al.
patent: 7068833 (2006-06-01), Ghinovker et al.
patent: 2002/0113218 (2002-08-01), Okumura et al.
patent: 2005/0219516 (2005-10-01), Smith et al.
patent: 2005/0240895 (2005-10-01), Smith et al.
patent: 58137213 (1983-08-01), None
KLA 5200, “Value-added Overlay Metrology for Advanced Lithography”, KLA 5200 Product Specifications, KLA Instruments Corporation, 2 pages, (1996).
Armitage Jr., J.D. et al, “Analysis of overlay distortion patterns”, Procs. of SPIE 921:207-222 1988.
Bjorkholm et al., “Reduction Imaging at 14 nm Using Multilayer-Coated Optics: Printing of Features Smaller than 0.1 μm”, J. Vac. Sci. Technol. B., 8(6):1509-1543 (1990).
Bruning et al., “Optical Lithography—Thirty Years and Three Orders of Magnitude”, Proc. of SPIE, 3051:14-27 (1997).
Cote et al., “MicrascanTM III-Performance of a Third Generation, Catadioptric Step and Scan Litographic Tool”, Proc. of SPIE, 3051:806-816 (1997).
DeJule, R., “Mix and Match: A Necessary Choice”, Semiconductor International, 23(2):66-76 (2000).
de Zwart et al., “Performance of a Step and Scan System for DUV Lithography”, Proc. of SPIE, 3051:817-835 (1997).
Dooly et al., “Stepper Matching for Optimum Line Performance”, Proc. of SPIE, 3051:426-432 (1997).
Goodwin et al., “Characterizing Overlay Registration of Concentric 5X and 1X Stepper Exposure Fields Using Interfield Data”, Proc. of SPIE, 3050:407-417 (1997).
Hasan et al., “Automated Electrical Measurements of Registration Errors in Step-and-Repeat Optical Lithography Systems”, IEEE Transactions on Electron Devices, ED27(12):2304-2312 (1980).
Kemp et al., “A ‘Golden Standard’ Wafer Design for Optical Stepper Characterization”, Proc. of SPIE, 1464:260-266 (1991).
KLA 5000 Series Applicate Note, “Overlay Target Design”,KLA Instruments Corporation, 4 pages, (1996).
KLA 5105, “Linewidth and Misregistration System”, KLA 5105 Product Specification, KLA Instruments Corporation, 2 pages (1995).
KLA 5200, “Value-added Overlay Metrology for Advanced Lithography”, KLA 5200 Product Specifications, KLA Instruments Corporation, 2 pages, (1996).
Kodama et al., “Measuring System XY-5i”, Proc. of SPIE, 2439:144-155 (1995).
Leica LMS IPRO, “Fully Automated Mask and Wafer Metrology System”, Leica, pamphlet pp. 1-5.
Lin, B.J., “The Attenuated Phase-Shifting Mask”, Solid State Technology, Special Series/Advanced Lithography, 35(1):43-47, (Jan. 1992).
MacMillen et al., “Analysis of Image Field Placement Deviations of 5X Microlithographic Reduction Lens”, Proc. of SPIE, 334:78-89 (1982).
Martin et al., “Measuring Fab Overlay Programs”, Proc. of SPIE, 3677:64-71 (1999).
McFadden et al., “A Computer Aided Engineering Workstation for Registration Control”, Proc. of SPIE, 1087:255-266 (1989).
Mulkens et al., “ArF Step and Scan Exposure System for 0.15 μm Technology Node?”, Proc. of SPIE, 3679:506-521 (1999).
Newman et al., “Development of XUV Projection Lithograph at 60-80 nm”, Proc. of SPIE, 1671:419-436 (1992).
Pellegrini, J.C., “Comparisons of Six Different Intrafield Control Paradigms in an Advanced Mix-and-Match Environment”, Proc. of SPIE, 3050:398-406 (1997).
Pellegrini et al., “Super Sparse Overlay Sampling Plans: An Evaluation of Methods and Algorithms for Optimizing Overlay Quality Control and Metrology Tool Throughput”, Proc. of SPIE. 3677:72-82 (1999).
Preil et al., “A New Approach to Correlating Overlay and Yield”, Proc. of SPIE, 3677:208-216 (1999).
Press et al., Numerical Recipes, “The Art of Scientific Computing”, Cambridge University Press, New York, pp. 52-64 (1990).
Quaestor Q7, “Fully Automated Optical Metrology System for Advanced IC Production”, Quaestor Q7 Product Specification, BIO-RAD, 2 pages.
Rai-Choudhury, P., Handbook of Microlithography, Micromachining and Microfabrication, Book: vol. 1, “Microlithography”, SPIE Optical Engineering Press, Proc. of SPIE, Bellingham, Washington, pp. 417-418 (1997).
Raugh, M.R., “Error Estimation for Lattice Methods of State Self-Calibration”, Proc. of SPIE, 3050:614-625 (1997).
Sullivan, N.T., “Semiconductor Pattern Overlay”, Proc. of SPIE Critical Reviews of Optical Science and Technology, CR52:160-188 (1994).
Takac et al., “Self-Calibration in Two-Dimensions: The Experiment”, Proc. of SPIE, 2725:130-146 (1996).
van den Brink et al., “Direct-Referencing Automatic Two-Points Reticle-to-Wafer Alignment Using a Projection Column Servo System”, Proc. of SPIE, 633:60-71 (1986).
van den Brink et al., “Matching Management of Multiple Wafer Steppers Using a Stable Standard and Matching Simulator”, Proc. of SPIE, 1087:218-232 (1989).
van den Brink et al., “Matching of Multiple Wafer Steppers for 0.35 μm Lithography Using Advanced Optimization Schemes”, Proc. of SPIE, 1926:188-207 (1993).
van den Brink et al., “Matching Performance for Multiple Wafer Steppers Using an Advanced Metrology Procedure”, Proc. of SPIE, 921:180-197 (1988).
van Schoot et al., “0.7 NA DUV Step & Step System for 150nm Imaging with Improved Overlay”, Proc. of SPIE, 3679:448-463 (1999).
Yost et al., “Lens Matching and Distortion Testing in a Multi-Stepper, Sub-Micron Environment”, Proc. of SPIE, 1087:233-244 (1989).
Zavecz et al., “Life Beyond Mix-and-Match: Controlling Sub-0.18 μm Overlay Errors”, Semiconductor International, 23(8):205,206,208,210,212 and 214 (2000).
Zavecz, T.E., “Machine Models and Registration”, Proc. SPIE Critical Reviews of Optical Science and Technology, CR52:134-159 (1994).
Hunter, Jr. Robert O.
McArthur Bruce B.
Smith Adlai H.
Epps Georgia
Litel Instruments
Yealy Christopher M
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