Semiconductor device manufacturing: process – With measuring or testing
Reexamination Certificate
2007-03-27
2007-03-27
Lindsay, Jr., Walter L. (Department: 2812)
Semiconductor device manufacturing: process
With measuring or testing
C438S015000, C257SE21568, C257SE23179
Reexamination Certificate
active
10305670
ABSTRACT:
A front-end-of-line piece of a semiconductor die is manufactured in a first manufacturing line. A back-end-of-line piece of a semiconductor die is manufactured using a second manufacturing line, which will typically be different than the first manufacturing line. The front-end-of-line piece and the back-end-of-line piece are combined during a joining process to form a semiconductor die. The semiconductor die is subsequently tested to determine if the semiconductor die is a functional semiconductor die.
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Jarvis Richard Wayne
McIntyre Michael G.
Advanced Micro Devices , Inc.
Lindsay Jr. Walter L.
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