Dielectric waveguide filter

Wave transmission lines and networks – Coupling networks – Wave filters including long line elements

Reexamination Certificate

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C333S239000

Reexamination Certificate

active

10502782

ABSTRACT:
A conductive layer is formed on each of the upper and lower surfaces of a dielectric substrate, and the two conductive layers are connected by rows of via-holes that are formed which a spacing that is less than or equal to ½ of the wavelength in the dielectric substrate in the resonance frequency, whereby n stages of dielectric resonators and input/output waveguide structures are formed. If the number n of stages is assumed to be 3, the first-stage resonator and the second-stage resonator are coupled by an electromagnetic field by means of via-holes of a first spacing; the second-stage resonator and the third-stage resonator are coupled by an electromagnetic by means of via-holes of a second spacing, whereby a filter is formed. The input/output waveguide structure and the filter are coupled by an electromagnetic by means of via-holes of a fourth spacing. The first-stage resonator and the third-stage resonator are coupled by an electromagnetic field by means of via-holes of a third spacing.

REFERENCES:
patent: 4246555 (1981-01-01), Williams
patent: 6160463 (2000-12-01), Arakawa et al.
patent: 6927653 (2005-08-01), Uchimura et al.
patent: 03-212003 (1991-08-01), None
patent: 11-284409 (1999-10-01), None
patent: 11-355010 (1999-12-01), None
patent: 2002-26610 (2002-01-01), None
patent: 2002-026611 (2002-01-01), None
Ito et al, “60-GHz-band Dielectric Waveguide Filters with Cross-coupling for Flip-chip Modules”, Microwave Symposium Digest, 2002 IEEE MTT-S International, vol. 3, Jun. 2-7, 2002, pp. 1789-1792.
Ito et al, “60-GHz-Band Planar Dielectric Waveguide Filters for Flip-Chip Modules”, IEEE Trans. on Microwave Theory & Tech., vol. 49, No. 12, Dec. 2001, pp. 2431-2436.
Japanese Office Action dated Feb. 1, 2005 with English translation of pertinent portions.

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