Substrate for producing a soldering connection

Details Substrate for producing a soldering connection Substrate for producing a soldering connection

2007-09-18

2007-09-18

Smoot, Stephen W. (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S779000, C257S786000, C257SE23020

Reexamination Certificate

active

10950185

ABSTRACT:
A solderable device includes a substrate and a soldering pad overlying the substrate. A solder mask overlies the substrate and portions of the soldering pad. The solder mask has an opening that exposes a portion of the soldering pad. The opening has at least two edges that symmetrically overlie portions of the soldering pad.

REFERENCES:
patent: 5400948 (1995-03-01), Sajja et al.
patent: 5872399 (1999-02-01), Lee
patent: 6201305 (2001-03-01), Darveaux et al.
patent: 6228466 (2001-05-01), Tsukada et al.
patent: 6337496 (2002-01-01), Jung
patent: 6555428 (2003-04-01), Jung
patent: 6734570 (2004-05-01), Archer
patent: 2002/0071935 (2002-06-01), Wu
patent: 2002/0111054 (2002-08-01), Huang et al.
patent: 2004/0099936 (2004-05-01), Caletka et al.
patent: 2000-036571 (2000-02-01), None
patent: 2001-230513 (2001-08-01), None
Harada et al., “Printed Board and Its Manufacturing Method,” English translation of JP 2001-230513 A, published by JPO on Aug. 24, 2001.

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