Plating apparatus and method

Details Plating apparatus and method Plating apparatus and method

2007-01-23

2007-01-23

Nguyen, Nam (Department: 1753)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating moving substrate

C205S157000, C205S137000, C204S199000, C204S212000, C204S214000

Reexamination Certificate

active

10204274

ABSTRACT:
A plating apparatus and method which smoothly perform contact of a plating liquid with a surface of the substrate and which can prevent air bubbles from remaining on the surface to be plated. The plating apparatus includes a plating bath containing a plating liquid in which an anode is immersed, a head portion for holding a substrate detachably and bringing a lower surface, to be plated, of the substrate into contact with an overflow surface of the plating liquid held in the plating bath, a drive mechanism for rotating the head portion, and a tilt mechanism for tilting the head portion so that the substrate held by the head portion is inclined relative to a horizontal plane.

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