Method of manufacturing a semiconductor device testing...

Details Method of manufacturing a semiconductor device testing... Method of manufacturing a semiconductor device testing...

2007-07-10

2007-07-10

Tugbang, A. Dexter (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S876000, C029S881000, C029S844000

Reexamination Certificate

active

11147167

ABSTRACT:
A contactor is placed between a semiconductor device and a test board. A contact electrode of the contactor electrically connects the semiconductor device to the test board. The contact electrode is formed of a conductive layer provided on an insulating substrate. The contact electrode comprises a first contact piece which contacts a terminal of the semiconductor device, a second contact piece which contacts an electrode of the test board, and a connecting portion which electrically connects the first contact piece and the second contact piece.

REFERENCES:
patent: 4548451 (1985-10-01), Benarr et al.
patent: 5139427 (1992-08-01), Boyd et al.
patent: 5228861 (1993-07-01), Grabbe
patent: 5759047 (1998-06-01), Brodsky et al.
patent: 5812378 (1998-09-01), Fjelstad et al.
patent: 5848685 (1998-12-01), Smith et al.
patent: 5926951 (1999-07-01), Khandros et al.
patent: 5994152 (1999-11-01), Khandros et al.
patent: 6029344 (2000-02-01), Khandros et al.
patent: 6179624 (2001-01-01), McHugh et al.
patent: 4-83355 (1992-03-01), None

Affiliated with

Also associated with

Rating

Method of manufacturing a semiconductor device testing... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing a semiconductor device testing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing a semiconductor device testing... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3794665