Cooling device, electronic equipment device, and method of...

Details Cooling device, electronic equipment device, and method of... Cooling device, electronic equipment device, and method of...

2007-03-13

2007-03-13

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S699000, C361S704000, C257S714000, C257S715000, C174S015200, C165S080400, C165S104260, C165S104330

Reexamination Certificate

active

10498335

ABSTRACT:
A compact, thin type and high cooling performance cooling device, an electronic apparatus and a method of manufacturing the same are provided. The cooling device (1) has a pair of a first substrate (2) and a second substrate (3) which are made of such a material having a low thermal diffusibility as glass, formed rectangular and bonded together via a silicon member (4). On bonding surfaces of these substrates (2) and (3), grooves (5) and (6) are formed. These grooves (5) and (6) are formed so as to function as a heat pipe of a loop type when these substrates (2) and (3) are bonded.

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Notification for Reasons for Refusal for counterpart Japanese Patent Application No. 2001-380601 issued by the Japanese Patent Office on Jun. 27, 2006.

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