Side view LED package having lead frame structure designed...

Details Side view LED package having lead frame structure designed... Side view LED package having lead frame structure designed...

2007-07-10

2007-07-10

Tran, Long K. (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

With housing or contact structure

C257S100000, C257S676000, C257S667000, C438S025000, C438S026000, C438S027000

Reexamination Certificate

active

11319100

ABSTRACT:
The invention relates to a side view LED package in use with an LCD backlight unit. The side view LED package comprises: an LED chip; and a strip-shaped lead frame having a toothed structure formed in a lateral edge thereof. The LED chip is mounted on a surface of the lead frame. An integral package body is made of resin, and includes a hollow front half having a cavity for housing the LED chip and a solid rear half divided from the front half by the lead frame. The toothed structure of the lead frame structure can improve resin flow in order to ensure stability even if the LED package is made extremely thin.

REFERENCES:
patent: 2004/0135156 (2004-07-01), Takenaka
patent: 2005/0141584 (2005-06-01), Ohe et al.

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