Polishing pad comprising hydrophobic region and endpoint...

Details Polishing pad comprising hydrophobic region and endpoint... Polishing pad comprising hydrophobic region and endpoint...

2007-04-17

2007-04-17

Wilson, Lee D. (Department: 3723)

Abrading

Abrading process

Glass or stone abrading

C451S527000, C451S528000, C451S530000, C451S533000

Reexamination Certificate

active

10808827

ABSTRACT:
The invention provides a chemical-mechanical polishing pad comprising a polishing layer comprising a hydrophobic region, a hydrophilic region, and an endpoint detection port. The hydrophobic region is substantially adjacent to the endpoint detection port. The hydrophobic region comprises a polymeric material having a surface energy of 34 mN/m or less and a polymeric material having a surface energy of more than 34 mN/m. The invention further provides a method of polishing a substrate comprising the use of the polishing pad.

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