Method of forming a polycrystalline silicon layer

Electric heating – Metal heating – By arc

Reexamination Certificate

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C219S121730, C438S487000, C438S488000, C438S799000, C257SE21134

Reexamination Certificate

active

11002274

ABSTRACT:
A method of forming a polycrystalline silicon layer. An amorphous silicon layer on a substrate is completely melted using a laser beam passed through a mask so as to form a polycrystalline silicon layer. The upper portion of the polycrystalline silicon layer is then re-melted and re-crystallized using a laser beam passed through a mask. The mask includes a high transmittance region for completely melting the amorphous silicon layer and a low transmittance region for re-melting the upper portion of the polycrystalline silicon layer.

REFERENCES:
patent: 4059461 (1977-11-01), Fan et al.
patent: 4267011 (1981-05-01), Shibata et al.
patent: 4409724 (1983-10-01), Tasch, Jr. et al.
patent: 5948289 (1999-09-01), Noda et al.
patent: 6169014 (2001-01-01), McCulloch
patent: 6194023 (2001-02-01), Mitsuhashi et al.
patent: 6387601 (2002-05-01), Abe
patent: 2002/0192572 (2002-12-01), Lau
patent: 409283441 (1997-10-01), None
patent: 410065205 (1998-03-01), None

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