Heat dissipation device with heat pipes

Details Heat dissipation device with heat pipes Heat dissipation device with heat pipes

2007-05-15

2007-05-15

Thompson, Greg (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S104330, C361S700000

Reexamination Certificate

active

10983609

ABSTRACT:
A heat dissipation device with heat pipes is described. The heat dissipation device has at least one L-shaped heat pipe, a plurality of heat fins, and a heat sink base. One end of the L-shaped heat pipe is coupled to one heat pipe fixing trench of the heat sink base so as to increase a contact area for transmitting heat and therefore improve a heat dissipation efficiency thereof. The heat fins includes at least one upper heat fin and at least one lower heat fin to couple to the L-shaped heat pipe via a round opening and a long opening respectively. The heat dissipation device therefore reduces a volume thereof and save an occupation space in an electrical device.

REFERENCES:
patent: 6779595 (2004-08-01), Chiang
patent: 6785104 (2004-08-01), Tallman et al.
patent: 6894900 (2005-05-01), Malone
patent: 2514401 (2002-10-01), None
patent: 551800 (2003-09-01), None

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