Method of making a microstructure using a circuit board

Details Method of making a microstructure using a circuit board Method of making a microstructure using a circuit board

2007-09-11

2007-09-11

King, Roy (Department: 1742)

Electrolysis: processes, compositions used therein, and methods

Electroforming or composition therefor

C205S078000, C205S125000, C427S098400, C427S099500

Reexamination Certificate

active

10670190

ABSTRACT:
A method of making a microstructure includes the steps of providing a circuit board that includes a dielectric layer and a conductor layer formed on the dielectric layer, forming a metal structure on the circuit board such that the metal structure extends through the dielectric layer, and removing at least a portion of the dielectric layer adjacent to the conductor layer and the metal structure to result in the microstructure.

REFERENCES:
patent: 6468439 (2002-10-01), Whitehurst et al.
patent: 2002/0027129 (2002-03-01), Heerman
patent: 681 758 (1993-05-01), None
patent: 40 12 100 (1991-10-01), None
patent: 2003-200396 (2003-07-01), None

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